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About this nonfiction
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) by TC, Chai (author);Ho, David (author);SC, Chong (author);HY, Hsiao (author);Soh, Serine (author);Lim, Simon (author);PS, Sharon Lim (author);Wai, Eva (author);BL, Lau (author);WW, Seit (author);GK, Lau (author);TS, Phua (author);Lim, Keith (author);SH, Sharon Lim (author);YL, Ye (author) is a nonfiction available to read on EtoBox.
It is typically read by self-directed learners exploring a subject in depth.
Common subject areas: history, science, philosophy, social sciences.
- Author
- TC, Chai (author);Ho, David (author);SC, Chong (author);HY, Hsiao (author);Soh, Serine (author);Lim, Simon (author);PS, Sharon Lim (author);Wai, Eva (author);BL, Lau (author);WW, Seit (author);GK, Lau (author);TS, Phua (author);Lim, Keith (author);SH, Sharon Lim (author);YL, Ye (author)
- Publisher
- IEEE
- Published
- 2020
- Language
- EN
- Category
- nonfiction