About this document
Bias Sputtering in Film Deposition by u11ee079 is a document available to read on EtoBox.
This document discusses various thin film deposition techniques. It covers important parameters for film quality such as thickness, uniformity, stress, and purity. It also reviews low pressure CVD which extends the surface reaction regime to higher temperatures by reducing mass transport limitations. Sputter deposition is described as using plasma to sputter atoms from a target that then deposit on wafers. Ionized sputter deposition ionizes depositing atoms to provide a narrow angular distribution for bette
- Author
- u11ee079
- Language
- EN