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About this Engineering article
A new 45° homo-biepitaxial YBCO grain boundary junction process fabricated using off-axis RF sputtering by Y. M. Lai; P. A. Lin; C. C. Chi is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Y. M. Lai; P. A. Lin; C. C. Chi
- Publisher
- Institute of Physics; IOP Publishing; Institute of Physics Publishing (ISSN 0022-3727)
- Published
- 2007
- Field
- Engineering (Physical Sciences)