About this scholarly article

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Diffusion on Two Interfaces of Ultrasonic Flip Chip Bonding by Li Junhui, ; Lei, Han; Jue, Zhong is a scholarly article available to read on EtoBox.

Author

Li Junhui, ; Lei, Han; Jue, Zhong

Publisher

IEEE

Published

2007