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This research article discusses the integration of metallized silicon die in the design of quad-flat no-leads (QFN) and ball grid array (BGA) packages to improve wire interconnection and reduce electrical shorting during assembly. The proposed design replaces traditional wiring techniques with a two-step connection that enhances stability and minimizes wire sway, thereby addressing common assembly challenges. The findings suggest that this innovative approach can be applied to future semiconductor packaging

Author

Tiong San Yeoh

Language

EN