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About this Engineering article
Mass Transfer Models for the Electrodeposition of Copper with a Buffering Agent by Gill, William N.; Duquette, David J.; Varadarajan, Desikan is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Gill, William N.; Duquette, David J.; Varadarajan, Desikan
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 2001
- Language
- EN
- Field
- Engineering (Physical Sciences)
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