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This document discusses wafer cleaning processes in VLSI fabrication. It introduces the concepts of front-end-of-line and back-end-of-line cleaning and the differences in surfaces that must be cleaned. It describes hydrophilic and hydrophobic surfaces and how they affect cleaning. The RCA clean process is discussed in detail as the most widely used clean. Variations of the RCA clean like the IMEC clean are also summarized. Common contaminants and cleaning chemicals are briefly outlined. The document conclud

Author

Rubel Riad

Language

EN