About this scholarly article

2008 10th Electronics Packaging Technology Conference - Reliability Characterization of Ni-based Microinsert Interconnections for Flip Chip Die on Wafer Attachment and Their Evaluation in Multichip SIMCARD Prototype by Boutry, Herve; Souriau, Jean-Charles; Brun, Jean; Franiatte, Remi; Nowodzinski, Antoine; Sillon, Nicolas; Dubois-Bonvalot, Beeatrice; Depoutot, Frederic; Brunet, Olivier; Peytavy, Alain is a scholarly article available to read on EtoBox.

Author

Boutry, Herve; Souriau, Jean-Charles; Brun, Jean; Franiatte, Remi; Nowodzinski, Antoine; Sillon, Nicolas; Dubois-Bonvalot, Beeatrice; Depoutot, Frederic; Brunet, Olivier; Peytavy, Alain

Publisher

IEEE

Published

2008

Language

EN