Opening book details…
About this Engineering article
Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation by Zhao, Y.; Basaran, C.; Cartwright, A.; Dishongh, T. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhao, Y.; Basaran, C.; Cartwright, A.; Dishongh, T.
- Publisher
- Walter de Gruyter GmbH & Co. KG; Walter de Gruyter GmbH (ISSN 0334-8938)
- Published
- 1999
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by Zhao, Y.; Basaran, C.; Cartwright, A.; Dishongh, T.
Browse all works by Zhao, Y.; Basaran, C.; Cartwright, A.; Dishongh, T.