About this scholarly article

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - BEOL process integration technology for 45 nm node porous low-k/copper interconnects by Matsunaga, N.; Nakamura, N.; Higashi, K.; Yamaguchi, H.; Watanabe, T.; Akiyama, K.; Nakao, S.; Fujita, K.; Miyajima, H.; Omoto, S.; Sakata, A.; Katata, T.; Kagawa, Y.; Kawashima, H.; Enomoto, Y.; Hasegawa, T.; Shibata, H. is a scholarly article available to read on EtoBox.

Author

Matsunaga, N.; Nakamura, N.; Higashi, K.; Yamaguchi, H.; Watanabe, T.; Akiyama, K.; Nakao, S.; Fujita, K.; Miyajima, H.; Omoto, S.; Sakata, A.; Katata, T.; Kagawa, Y.; Kawashima, H.; Enomoto, Y.; Hasegawa, T.; Shibata, H.

Publisher

IEEE

Published

2005

Language

EN