Skip to content

Opening book details…

Can I read Coupling Effect of Porosity and Cell Size on the Deformation Behavior of Al Alloy Foam under Quasi-Static Compression on EtoBox?

Coupling Effect of Porosity and Cell Size on the Deformation Behavior of Al Alloy Foam under Quasi-Static Compression by Yang, Donghui; Wang, Hui; Guo, Sensen; Chen, Jianqing; Xu, Yongmin; Lei, Dong; Sun, Jiapeng; Wang, Lei; Jiang, Jinghua; Ma, Aibin is a Engineering article available to read on EtoBox.

What is Coupling Effect of Porosity and Cell Size on the Deformation Behavior of Al Alloy Foam under Quasi-Static Compression about?

Closed-cell AlCu5Mn alloy foam with porosity range of ~45–90% were fabricated by the melt-foaming route. The pore structure of the fabricated Al alloy foam was analyzed and the coupling effect of porosity and cell size on the quasi-static compression behavior of the foam was investigated. The results show that the cell size of the foam decreases with the porosity decline from the view of the contribution rate to the porosity and the hierarchical pore structure characteristics becomes obvious when the foam porosity is low; the compression stress–strain curves of the foams with high porosity (>74%) are serrated due to the large cell size being easy to deform and more strain needed to let the stress recover. Meanwhile, the compression curve of the foams with low porosity (<74%) are smooth without serration, which is attributed to the hierarchical pore structure and less strain needed to let the stress recovery.

Who reads Coupling Effect of Porosity and Cell Size on the Deformation Behavior of Al Alloy Foam under Quasi-Static Compression?

It is typically read by researchers, students, and practitioners in Engineering.

Author
Yang, Donghui; Wang, Hui; Guo, Sensen; Chen, Jianqing; Xu, Yongmin; Lei, Dong; Sun, Jiapeng; Wang, Lei; Jiang, Jinghua; Ma, Aibin
Publisher
MDPI Publishing; MDPI AG; Multidisciplinary Digital Publishing Institute (MDPI); Basel: MDPI, 2003- (ISSN 1660-3397)
Published
2019
Language
EN
Field
Engineering (Physical Sciences)

More by Yang, Donghui; Wang, Hui; Guo, Sensen; Chen, Jianqing; Xu, Yongmin; Lei, Dong; Sun, Jiapeng; Wang, Lei; Jiang, Jinghua; Ma, Aibin

Browse all works by Yang, Donghui; Wang, Hui; Guo, Sensen; Chen, Jianqing; Xu, Yongmin; Lei, Dong; Sun, Jiapeng; Wang, Lei; Jiang, Jinghua; Ma, Aibin