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About this Engineering article
A Novel Signal Integrity Methodology By 3d Direct Analysis For Microwave Testing Probes by Wu, Sung-Mao; Guan, Sheng-Wei is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wu, Sung-Mao; Guan, Sheng-Wei
- Publisher
- The Electromagnetics Academy (EMW Publishing); Electromagnetics Academy; Cambridge MA: EMW Pub.; EMW Publishing (ISSN 1937-8718)
- Published
- 2010
- Field
- Engineering (Physical Sciences)