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The article presents a novel die-bonding technology using inductive sintering of silver micro particles for bonding microelectronic components, which allows for localized heating and significantly reduced sintering times. Experimental trials and finite element simulations demonstrate the effectiveness of this method in bonding diodes to direct bonded copper substrates, resulting in high-quality, reliable connections. The findings suggest that this technology has the potential to enhance productivity and red

Author

jxfmmo

Language

EN