About this scholarly article

SPIE Proceedings [SPIE International Conference on Experimental Mechnics 2008 and Seventh Asian Conference on Experimental Mechanics - Nanjing, China (Saturday 8 November 2008)] ICEM 2008: International Conference on Experimental Mechanics 2008 - Validation and reliability assessment of board level drop test of chip-scale-packaging by Hung, Tuan-Yu; He, Xiaoyuan; Xie, Huimin; Chou, Chan-Yen; Yew, Ming-Chih; Kang, YiLan; Chiang, Kuo-Ning is a scholarly article available to read on EtoBox.

Author

Hung, Tuan-Yu; He, Xiaoyuan; Xie, Huimin; Chou, Chan-Yen; Yew, Ming-Chih; Kang, YiLan; Chiang, Kuo-Ning

Publisher

SPIE

Published

2008

Language

EN