About this scholarly article

2006 International Microsystems, Package, Assembly Conference Taiwan - Stress and Thermal Characteristic Analyses for Advanced FCBGA Packages by Tzeng, Yuan; Chen, Eason; Lai, Jeng; Wang, Yu; Hsiao, C.s. is a scholarly article available to read on EtoBox.

Author

Tzeng, Yuan; Chen, Eason; Lai, Jeng; Wang, Yu; Hsiao, C.s.

Publisher

IEEE

Published

2006

Language

EN