About this document
Enhancing SMT Yields via Stencil Design by Fernando Rodriguez is a document available to read on EtoBox.
The document discusses improving SMT assembly yields through root cause analysis of common defects in the solder paste printing process. It analyzes defects like poor solder paste release, solder balls, tombstoning, bridging, insufficient solder volume and voiding. It identifies the root causes of these defects and provides stencil design recommendations to eliminate defects and improve yields.
- Author
- Fernando Rodriguez
- Language
- EN