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Module 8 discusses the aluminum wet etch process in semiconductor manufacturing, highlighting the importance of aluminum as a conductor for interconnections despite its low melting point and susceptibility to oxidation. It compares aluminum deposition techniques, specifically Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD), detailing their mechanisms, advantages, and disadvantages. The module also covers characterization methods for aluminum thin films, including thickness and sheet resi

Author

Afrina Fazrul

Language

EN