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About this Engineering article
Numerical Evaluation of Thermal Cycling Reliability of High Performance Flip‐chip Package Assembly Using Submodeling Analysis by Kao, Chin‐Li; Lai, Yi‐Shao; Wang, Tong Hong is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kao, Chin‐Li; Lai, Yi‐Shao; Wang, Tong Hong
- Publisher
- Chinese Electronic Periodical Services; Informa UK (Taylor & Francis); Taylor & Francis; Informa UK Limited (ISSN 0253-3839)
- Published
- 2007
- Language
- EN
- Field
- Engineering (Physical Sciences)
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