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Heterostructure of NiCoAl-layered double hydroxide nanosheet arrays assembled on MXene coupled with CNT as conductive bridge for enhanced capacitive deionization by Le Zhang; Yue Wang; Yanmeng Cai; Rongli Fang; Shunjiang Huang; Yanshuang Zhao; Shasha Zhang is a Engineering article available to read on EtoBox.
What is Heterostructure of NiCoAl-layered double hydroxide nanosheet arrays assembled on MXene coupled with CNT as conductive bridge for enhanced capacitive deionization about?
Layered double hydroxide (LDH) is considered as an attractive capacitive deionization (CDI) faradic material for anion (such as Cl -) capture due to its excellent anion storage capacity, highly reversible anion (de)insertion and superior chemical stability. Nevertheless, the self-stacking property and poor conductivity of LDH lead to undesirable CDI performance. Herein, the CNT@NiCoAl-LDH@MXene heterostructure with three-dimensional (3D) interconnected network was rationally designed with MXene as the conductive substrate for the uniform and vertical growth of NiCoAl-LDH nanosheet arrays and CNT as the conductive bridge for fast electron transfer. Strong chemical bonding interactions were formed at the interface of this heterostructure, creating tighter and more stable interconnections. Moreover, the specific surface area of this unique arrays structure is 4.28 and 8.62 times that of NiCoAl-LDH and MXene, respectively, effectively suppressing the aggregation of layered materials and providing more exposed active sites. Therefore, the obtained CNT@NiCoAl-LDH@MXene electrode exhibits prominent specific capacitance (179 F g -1 ), decreased equivalent series and transfer resistance, in
Who reads Heterostructure of NiCoAl-layered double hydroxide nanosheet arrays assembled on MXene coupled with CNT as conductive bridge for enhanced capacitive deionization?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Le Zhang; Yue Wang; Yanmeng Cai; Rongli Fang; Shunjiang Huang; Yanshuang Zhao; Shasha Zhang
- Publisher
- Elsevier BV
- Published
- 2023
- Language
- EN
- Field
- Engineering (Physical Sciences)