About this scholarly article

SPIE Proceedings [SPIE SPIE Sensing Technology + Applications - Baltimore, Maryland, United States (Monday 20 April 2015)] Thermosense: Thermal Infrared Applications XXXVII - Measurement of flaw size from thermographic data by Hsieh, Sheng-Jen (Tony); Zalameda, Joseph N.; Winfree, William P.; Zalameda, Joseph N.; Howell, Patricia A. is a scholarly article available to read on EtoBox.

Author

Hsieh, Sheng-Jen (Tony); Zalameda, Joseph N.; Winfree, William P.; Zalameda, Joseph N.; Howell, Patricia A.

Publisher

SPIE

Published

2015