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Numerical Simulation and Experimental Analysis of the Semi-Solid Thixotropic Extrusion Forming Process for Producing the Thin-Wall Wrought Aluminum Alloy Mobile Phone Shells by Guo, Yi (author);Wang, Yongfei (author);Zhao, Shengdun (author) is a Engineering article available to read on EtoBox.

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Author
Guo, Yi (author);Wang, Yongfei (author);Zhao, Shengdun (author)
Publisher
MDPI AG
Published
2021
Field
Engineering (Physical Sciences)