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Effect of Different Abrasives on Chemical Mechanical Polishing for Magnesia Alumina Spinel by Wang, Zhan Kui; Pang, Ming Hua; Su, Jian Xiu; Yao, Jian Guo is a Engineering article available to read on EtoBox.

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In this paper, a series of chemical mechanical polishing (CMP) experiments for magnesia alumina (Mg-Al) spinel were carried out with different abrasives, and the materials removal rate (MRR) and surface quality was evaluated to explore their different effects. The scanning electron microscope (SEM) and laser particle size analyzer were also employed to test the micro-shape and size distribution of abrasives. Then, the mechanism of different effects with different abrasives was analyzed in CMP for Mg-Al spinel. Those experimental results suggest that different subjecting pressure ratios of abrasives to polishing pad with different abrasive are the key factors leading to difference polishing performances in CMP.

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Author

Wang, Zhan Kui; Pang, Ming Hua; Su, Jian Xiu; Yao, Jian Guo

Publisher

Trans Tech Publications, Ltd.; Trans Tech Publications Ltd. (ISSN 1662-9795)

Published

2020

Language

EN

Field

Engineering (Physical Sciences)