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About this Engineering article
Thermomechanical properties and fatigue life evaluation of SnAgCu solder joints for microelectronic power module application by Huang, Xiaoguang; Wang, Zhiqiang; Yu, Yanqun is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Huang, Xiaoguang; Wang, Zhiqiang; Yu, Yanqun
- Publisher
- Elsevier ; Elsevier Editora Ltda; Elsevier BV (ISSN 2238-7854)
- Published
- 2020
- Field
- Engineering (Physical Sciences)
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