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About this Engineering article
Thin-film decoupling capacitors for multichip modules : DUANE DIMOS, STEVEN J. LOCKWOOD, ROBERT W. SCHWARTZ and M. STEVEN RODGERS. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18(1), 174 (March 1995) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1996
- Field
- Engineering (Physical Sciences)