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About this Engineering article
Finite element modeling to analyze durability of BGA/CSP connections during thermal shock by Khan, Subhotosh; Molligan, Dan J. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Khan, Subhotosh; Molligan, Dan J.
- Publisher
- Emerald Group Publishing Limited; Emerald (MCB UP ); Emerald Group Publishing Ltd.; Emerald (ISSN 0305-6120)
- Published
- 2001
- Field
- Engineering (Physical Sciences)