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About this Engineering article
A Novel Wafer Manipulation Method for Yield Improvement and Cost Reduction of 3D Wafer-on-Wafer Stacked ICs by Zhang, Bei; Agrawal, Vishwani D. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhang, Bei; Agrawal, Vishwani D.
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC (ISSN 0923-8174)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)