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Study of Conductor Surface Roughness Impact on Package Insertion Loss by Lo, H. Louis ;Cheah, Bok Eng is a scholarly article available to read on EtoBox.
- Author
- Lo, H. Louis ;Cheah, Bok Eng
- Publisher
- IEEE
- Published
- 2015
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Study of Conductor Surface Roughness Impact on Package Insertion Loss
by Lo, H. Louis, Cheah, Bok Eng
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Published by IEEE (2015).
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- IEEE
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- 2015
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