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Creep Properties of Lead-Free Solders by sardar4056 is a document available to read on EtoBox.
This study investigates the creep properties of Sn–Sb based lead-free solder alloys, specifically Sn–5 wt.%Sb, Sn–5 wt.%Sb–3.5 wt.%Ag, and Sn–5 wt.%Sb–1.5 wt.%Au. The results indicate that the Sn–5Sb–1.5Au alloy exhibits superior creep resistance and rupture time compared to the other alloys, attributed to its microstructure and intermetallic compounds. The research highlights the importance of understanding the mechanical behavior of these alloys for their application in electronic devices.
- Author
- sardar4056
- Language
- EN