About this scholarly article

2009 11th Electronics Packaging Technology Conference - Development of high speed board level bend tester for drop impact applications by Lim, Shu Min; Chen, Zhong; Ng, Hun Shen; Tee, Tong Yan; Khoo, Choong Peng; Chng, Vincent; Liu, Fu Lin; Tsai, Kuo Tsing is a scholarly article available to read on EtoBox.

Author

Lim, Shu Min; Chen, Zhong; Ng, Hun Shen; Tee, Tong Yan; Khoo, Choong Peng; Chng, Vincent; Liu, Fu Lin; Tsai, Kuo Tsing

Publisher

IEEE

Published

2009

Language

EN