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About this Engineering article
Thermal comparison of flip-chip relative to chip-and-wire semiconductor attachment in hybrid circuits: an experimental approach : D. M. Cavanaugh. IEEE Trans. Parts, Hybrids, PackagingPHP-12 (4), 293 (December 1976) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1977
- Language
- EN
- Field
- Engineering (Physical Sciences)