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About this Physics and Astronomy article
Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator by Zhao, Ji-Cong; Yuan, Quan; Wang, Feng-Xiang; Kan, Xiao; Han, Guo-Wei; Sun, Ling; Sun, Hai-Yan; Yang, Jin-Ling; Yang, Fu-Hua is a Physics and Astronomy article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Physics and Astronomy.
- Author
- Zhao, Ji-Cong; Yuan, Quan; Wang, Feng-Xiang; Kan, Xiao; Han, Guo-Wei; Sun, Ling; Sun, Hai-Yan; Yang, Jin-Ling; Yang, Fu-Hua
- Publisher
- IOP Publishing; Institute of Physics Publishing (ISSN 1674-1056)
- Published
- 2017
- Field
- Physics and Astronomy (Physical Sciences)