About this scholarly article

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Process development of electroplate bumping for ULSI flip chip technology by Kiumi, R.; Yoshioka, J.; Kuriyama, F.; Saito, N.; Shimoyama, M. is a scholarly article available to read on EtoBox.

Author

Kiumi, R.; Yoshioka, J.; Kuriyama, F.; Saito, N.; Shimoyama, M.

Publisher

IEEE

Published

2002

Language

EN