Can I read Advanced MEMS Packaging (Electronic Engineering) on EtoBox?

Advanced MEMS Packaging (Electronic Engineering) by John H Lau; Chengkuo Lee; C S Premachandran; Yu Aibin; et al is a nonfiction available to read on EtoBox.

What is Advanced MEMS Packaging (Electronic Engineering) about?

A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging. This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices. The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability. Among the topics explored: Advanced IC and MEMS packaging trends MEMS devices, commercial applications, and markets More than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and handling Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding technique

Who reads Advanced MEMS Packaging (Electronic Engineering)?

Author

John H Lau; Chengkuo Lee; C S Premachandran; Yu Aibin; et al

Publisher

McGraw-Hill; McGraw-Hill Education; McGraw Hill

Published

2009

Language

EN

ISBN

9780071627924

Category

nonfiction

Subjects

Engineering, Technology, Stem