Opening book details…
About this Engineering article
Preparation of Sn–Ag–In Solder Bumps by Electroplating of Sn–Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength by Wang, D.-L.; Yuan, Y.; Luo, L. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Wang, D.-L.; Yuan, Y.; Luo, L.
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2012
- Field
- Engineering (Physical Sciences)