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Influence of the Interaction Between Chloride and Thiourea on Copper Electrodeposition by Nisit Tantavichet; Somsak Damronglerd; Orawan Chailapakul is a Engineering article available to read on EtoBox.

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The interaction between chloride and thiourea in copper electrodeposition in a sulfate-plating bath was investigated. The sole addition of thiourea to the bath increased the polarization of the electrode potential during copper deposition, leading to very fine and smoothly structured deposit but with microscopic nodules distributed over the surface. When chloride was added to a plating solution containing thiourea, the copper deposition mechanism was changed, showing a depolarization of the electrode potential, and the copper deposits were found to have a relatively rougher microstructure, but without the formation of microscopic nodules. However, rough deposit surfaces having no distinct pattern were formed at the macroscopic scale. Observations of roughening evolution show that the rough surface was initiated from small holes formed across the deposit surface during the initial stage of deposition that eventually developed into visibly rough deposits. The copper deposition inside these holes and at other areas was expected to undergo different deposition mechanisms. Copper deposition in the areas that ultimately developed into holes was almost totally inhibited by the thiourea-Cu

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Author

Nisit Tantavichet; Somsak Damronglerd; Orawan Chailapakul

Publisher

Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0013-4686)

Published

2009

Language

EN

Field

Engineering (Physical Sciences)