About this scholarly article

2017 IEEE International Interconnect Technology Conference (IITC) - Fabrication and characterization of copper nanowires with dense nanoscale twin boundaries by Weng, Wei-Lun; Lai, Wen-Hao; Jheng-Syun, ; Lee, ; Liao, Chien-Neng is a scholarly article available to read on EtoBox.

Author

Weng, Wei-Lun; Lai, Wen-Hao; Jheng-Syun, ; Lee, ; Liao, Chien-Neng

Publisher

IEEE

Published

2017

Language

EN