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Comparative Study of the Photoelectric and Thermal Performance Between Traditional and Chip-Scale Packaged White LED by Chen, Cong (author);Zhao, Dezhi (author);Xiong, Zhihua (author);Niu, Yunfei (author);Sun, Zhenhui (author);Xiao, Weimin (author) is a Engineering article available to read on EtoBox.

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Author
Chen, Cong (author);Zhao, Dezhi (author);Xiong, Zhihua (author);Niu, Yunfei (author);Sun, Zhenhui (author);Xiao, Weimin (author)
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published
2021
Field
Engineering (Physical Sciences)