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About this Engineering article
Comparative Study of the Photoelectric and Thermal Performance Between Traditional and Chip-Scale Packaged White LED by Chen, Cong (author);Zhao, Dezhi (author);Xiong, Zhihua (author);Niu, Yunfei (author);Sun, Zhenhui (author);Xiao, Weimin (author) is a Engineering article available to read on EtoBox.
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- Author
- Chen, Cong (author);Zhao, Dezhi (author);Xiong, Zhihua (author);Niu, Yunfei (author);Sun, Zhenhui (author);Xiao, Weimin (author)
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Published
- 2021
- Field
- Engineering (Physical Sciences)