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Can I read Wafer Bonding: Applications and Technology (Springer Series in Materials Science Book 75) on EtoBox?
Wafer Bonding: Applications and Technology (Springer Series in Materials Science Book 75) by J. Haisma (auth.), Dr. Marin Alexe, Prof. Dr. Ulrich Gösele (eds.) is a nonfiction available to read on EtoBox.
What is Wafer Bonding: Applications and Technology (Springer Series in Materials Science Book 75) about?
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Who reads Wafer Bonding: Applications and Technology (Springer Series in Materials Science Book 75)?
It is typically read by self-directed learners exploring a subject in depth.
Common subject areas: history, science, philosophy, social sciences.
- Author
- J. Haisma (auth.), Dr. Marin Alexe, Prof. Dr. Ulrich Gösele (eds.)
- Publisher
- Springer-Verlag Berlin Heidelberg
- Published
- 2004
- Language
- EN
- ISBN
- 9783642059155
- Category
- nonfiction
- Subjects
- Science, Technology, Engineering
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