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About this Engineering article
Thin, High Atomic Weight Refractory Film Deposition for Diffusion Barrier, Adhesion Layer, and Seed Layer Applications by Rossnagel, S. M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Rossnagel, S. M.
- Publisher
- AVS (American Vacuum Society); American Vacuum Society; American Institute of Physics (ISSN 0734-211X)
- Published
- 1996
- Field
- Engineering (Physical Sciences)