About this Materials Science article
Optimal Cu paste thickness for large-area Cu-Cu joint by Lingmei Wu; Jing Qian; Jiabing Yu; Haojie Guo; Xianping Chen is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Lingmei Wu; Jing Qian; Jiabing Yu; Haojie Guo; Xianping Chen
- Publisher
- Elsevier BV
- Published
- 2021
- Language
- EN
- Field
- Materials Science (Physical Sciences)