About this scholarly article

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Chip-to-wafer (C2W) 3D integration with well-controlled template alignment and wafer-level bonding by Chen, Qianwen; Zhang, Dingyou; Wang, Zheyao; Liu, Litian; Lu, James Jian-Qiang is a scholarly article available to read on EtoBox.

Author

Chen, Qianwen; Zhang, Dingyou; Wang, Zheyao; Liu, Litian; Lu, James Jian-Qiang

Publisher

IEEE

Published

2011