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This document summarizes a study analyzing the cause of discoloration on a NiPdAu surface finish commonly used in the semiconductor industry. Scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS), time-of-flight secondary ion mass spectrometry (TOF-SIMS), and X-ray photoelectron spectroscopy (XPS) were used to analyze surfaces with and without discoloration. The analyses indicated that copper was migrating from unplated pillars of copper leads underneath the NiPdAu finish, contami

Author

James Belciña

Language

EN