About this scholarly article

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Characterization of intermetallic compound (IMC) growth in Cu wire ball bonding on Al pad metallization by Na, SeokHo; Hwang, TaeKyeong; Park, JungSoo; Kim, JinYoung; Yoo, HeeYeoul; Lee, ChoonHeung is a scholarly article available to read on EtoBox.

Author

Na, SeokHo; Hwang, TaeKyeong; Park, JungSoo; Kim, JinYoung; Yoo, HeeYeoul; Lee, ChoonHeung

Publisher

IEEE

Published

2011

Language

EN