About this scholarly article

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Analysis of mechanical strength for flip-chip bonding of GaAs MMIC by Bo Zhang, ; Murugesan, V.; Billstrom, N.; Stenquist, P.; Liu, J. is a scholarly article available to read on EtoBox.

Author

Bo Zhang, ; Murugesan, V.; Billstrom, N.; Stenquist, P.; Liu, J.

Publisher

IEEE

Published

2006