About this scholarly article

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode by Deshpande, Abhishek; Jiang, Qian; Dasgupta, Abhijit; Becker, Ulrich is a scholarly article available to read on EtoBox.

Author

Deshpande, Abhishek; Jiang, Qian; Dasgupta, Abhijit; Becker, Ulrich

Publisher

IEEE

Published

2019