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About this Engineering article
Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding by Geissler, U.; Schneider-Ramelow, M.; Reichl, H. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Geissler, U.; Schneider-Ramelow, M.; Reichl, H.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3331)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)
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