About this scholarly article

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) - Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies by Wang, K.; Huang, Y.; Chandra, A.; Hu, K.X. is a scholarly article available to read on EtoBox.

Author

Wang, K.; Huang, Y.; Chandra, A.; Hu, K.X.

Publisher

IEEE

Published

2000