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About this Materials Science article
High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization by Peng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Peng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2006
- Language
- EN
- Field
- Materials Science (Physical Sciences)