About this Engineering article
Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration by Xavier Gagnard; Thierry Mourier is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Xavier Gagnard; Thierry Mourier
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-9317)
- Published
- 2010
- Language
- EN
- Field
- Engineering (Physical Sciences)