About this scholarly article

Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing) - Influences on thermal fatigue reliability of QFP component solder joints based on physic-of-failure method by Xinghao Wang, ; Jiang Shao, ; Xiaoyu Liu, ; Fengming Lu, is a scholarly article available to read on EtoBox.

Author

Xinghao Wang, ; Jiang Shao, ; Xiaoyu Liu, ; Fengming Lu,

Publisher

IEEE

Published

2012

Language

EN